The Structure of Microelectronics
The best of microelectronics packaging and interconnection technologies

22nd European Microelectronics and Packaging Conference (EMPC) & Exhibition

The European Microelectronics and Packaging Conference (EMPC) is the established international forum for engineers working in the field and others wanting to learn from this leading event.

EMPC-2019 in Pisa offers the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this field. The four days will comprise Tutorials/Short Courses and the Conference and Exhibition during 16th to 19th September at the Palazzo Dei Congressi, an ideal venue which includes excellent lecture auditoria, exhibition space and a great social venue. The event will be complemented by social events for which IMAPS has a great tradition.

Pisa where tradition, art, culture and business meet harmoniously is ideally located also to extend your visit in Italy.

See you in Pisa!

The Conference will start in:

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Pisa, the charming city in the famous Tuscany region

Pisa is a visitors’ paradise with many places of interest to visit. The International Airport “Galileo Galilei” is only 2.7 km away from the Conference Centre and it's one of the main Italian airports with flights to over 74 destinations

Call for papers

04 June, 2018 Researchers and innovators in industry and academia are cordially invited to submit papers on the range of Microelectronics Technologies and Photonics Technologies, for oral or poster presentation at the Conference.

Keyote speakers

Nov.8, 2018 The first Keynote Speakers are online! More to be announced soon