EMPC 2019, Pisa - The Structure of Microelectronics

The European Microelectronics and Packaging Conference (EMPC) is the established international forum for engineers working in the field and others wanting to learn from this leading event.

EMPC-2019 in Pisa offers the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this field. The four days will comprise Tutorials/Short Courses and the Conference and Exhibition during 16th to 19th September at the Palazzo Dei Congressi, an ideal venue which includes excellent lecture auditoria, exhibition space and a great social venue. The event will be complemented by social events for which IMAPS has a great tradition. 

As with all events organised by the International Microelectronics and Packaging Society (IMAPS) the event will offer excellent networking opportunities at a most attractive venue.

EMPC-2019 is enhanced by the technical co sponsorship of IEEE-EPS, which further broadens the scope and relevance of the event.

Pisa is a splendid and picturesque city with wonderful facilities and easy travel to and from airports, railway station and roads.
Pisa, where tradition, art, culture and business meet harmoniously is ideally located also to extend your visit in Italy.

See you in Pisa!

Event presentation

See also