Keynote Speakers

Marc Desmulliez

Title: Wireless power transfer of medical implanted devices: packaging implications

Prof. Marc Desmulliez, Professor at Heriot-Watt University - Edinburgh, Scotland

Prof. Marc Desmulliez is currently a Professor at Heriot-Watt University (Edinburgh, Scotland) where he created the first UK Master of Science in Microsystems Engineering in 2001. This Master of Science is still running under the Erasmus Mundus Programme under the title Smart Systems Integration. He is currently leading the multi-modal sensing and micromanipulation research group (CAPTURE) which aims to provide technological solutions for the design, manufacturing, packaging and test of multi-modal sensors and systems capable of manipulating micron-size particles or biological elements.

He graduated from the Ecole Superieure d’Electricite (SUPELEC) of Paris in 1987, University College London in 1988, the University of Cambridge in 1991 (and 2011),  and Heriot-Watt University in 1995.

His current research interests are in microwave engineering, MEMS, medical device technology and nature inspired manufacturing. He has co-authored over 466 peer-reviewed publications and holds 8 patents. He is a Fellow of the UK Institute of Physics, the Royal Society of Edinburgh and  the Institute of Engineering and Technology. After a short stay in industry, he span out two companies, specialised in stencil manufacturing and microwave sensing, respectively, and started up another company manufacturing birthing mirrors to help pregnant mothers  enjoying waterbirths.

Prof. Desmulliez was recently involved, under the UK programme grant called Sonopill, in the design, manufacture and test of an ultrasound endoscopic capsule aimed at the diagnostics of pathologies of the gastro-intestinal tract, where wireless power transfer solutions and new methodologies to test biocompatibility and reliability of such a device needed to be found.

 

Laurent Herard

Title: Packaging innovation – A key enabler for a smart world

Laurent Herard, Group VP - Head of Back End Manufacturing & Technology R&D @ STMicroelectronics

Laurent is Group VP – Head of the Back End Manufacturing & Technology R&D at STMicroelectronics. He is located in Singapore.

He received an Engineering Degree in physics of semiconductor from the INP Grenoble France.

Laurent has twenty-seven years of experience in Packaging design R&D and Back End assembly manufacturing in Europe, Morocco, Singapore and Malaysia

Dwight Howard

Title: Integrated Intelligent Transportation And Key Enablers

Dwight Howard, APTIV, Manager, Electrical Engineering, North America & Asia-Pacific Product Development, Infotainment and Driver Information (IDI) PBU, Electronics & Safety Division

Klaus-Dieter Lang

Title: Functionality and Cost First – A Challenge for Electronic Packaging

Prof. Klaus-Dieter Lang, Head of Fraunhofer Institute for Reliability and Microintegration IZM – Berlin, Germany

Klaus-Dieter Lang (M’08, SM’13, F’18) received the Dipl.-Ing. (M.Sc.) and the Dr.-Ing. (Ph.D.) degrees in electrical engineering from Humboldt University (HU), Berlin, Germany, in 1981 and 1985, respectively. In 1989, he completed his habilitation and received the Dr. sc. techn. degree in electrical engineering from HU.

In 1981, he joined the Humboldt University as a researcher, where he was engaged in microelectronic assembly, packaging, and quality assurance up till 1991. In 1991, he joined SLV Hannover to build up a department for microelectronic and optical components manufacturing. In 1993, he joined the Fraunhofer-Institute for Reliability and Microintegration Berlin, IZM, and became a Group Manager for Chip Interconnections. He served as the Director’s personal assistant from 1995 to 2000, and was also responsible for Marketing and Public Relations at IZM. From 2001 to 2005, he coordinated IZM’s Branch Lab “Microsystem Engineering,” in Adlershof, Berlin. From 2003 to 2005, he was Head of the Department of “Photonic and Power System Assembly” and from 2006 to 2010, he served as the Deputy Director of IZM. Since 2010 he has been the Director of the institute, and since 2011 he has been a full professor at the Technische Universität (TU) Berlin, where he is responsible for the chair “Nano Interconnect Technologies”.

He is the author and co-author of four books, and more than 350 publications in the field of wire bonding, microelectronic packaging and system integration, microsystems technologies and chip-on-board. Prof. Lang is a member of numerous scientific boards and conference committees, which include the Semiconductor Equipment and Materials International (SEMI) Award Committee, the Scientific Advisory Board of the European Cluster of Electronic Packaging and Integration of Micro Devices and Smart Systems (EURIPIDES), the Executive Board of VDE-GMM, and the Scientific Chair of the Conference “Technologies of Printed Circuit Boards” and “SMT/HYBRID/PACKAGING.” He is a member of the Deutscher Verband für Schweißen und verwandte Verfahren eV (DVS), IEEE, and the International Microelectronic and Packaging Society (IMAPS). He plays an active role in the international packaging community as well as in the organization of international conferences, e.g., the Smart System Integration (SSI) Conference.

In 2017, Prof. Lang received the William D. Ashman Achievement Award from IMAPS for his exceptional contribution to the development of electronic packaging for advanced system integration worldwide. He is a Fellow, and Life Member of IMAPS, as well as a Fellow of IEEE.

Nan Wang

Title: Accelerating the Digital Transformation – An Ecosystem View

Mr. Nan Wang, Cisco Systems, Inc. Sr. Director, Technology and Quality, Supply Chain Operations

Nan Wang has been with Cisco Systems for 17 years, where he serves as Sr. Director in the Technology and Quality organization within Cisco's global Supply Chain Operations. He leads the Component Quality and Technology Group, with focus on strategic component technology development for next generation products across Cisco.

In recent years, his team has been focusing on the component technology innovations, such as Silicon Photonics, 2.5D/3D 1C, to enable the next generation of the networking applications and accelerate the digital transformation.

Marco Romagnoli

Dr. Marco Romagnoli, Head of Advanced Technologies for Photonic Integration at CNIT in Pisa, contract professor at Scuola Superiore S. Anna in Pisa, and former Director in R&D dept. - Pisa, Italy

He has over 30 years of experience in Research, especially in the area of photonic technologies for TLC. After the Laurea Degree in Physics at the University of Rome (La Sapienza), in 1983 he started his activity at IBM Research Center in San Jose. In 1984 he joined Fondazione Ugo Bordoni in the Optical Communications Department working on optical components and transmission systems. In 1998 he joined Pirelli. In Pirelli R&D Photonics served as director of Design and Characterization and Chief Scientist.. Since 2001 he pioneered the activity on Si Photonics in Pirelli Labs and started the development platform for optical components, specifically silica based PLC’s, SiN, and Si Photonics. This activity included also a 5 years program at MIT that he managed. In Oct 2010 he joined PhotonIC Corp, a Si Photonics company, as Director of Boston Operations and program manager at MIT (Massachusetts Institute of Technology) for the development of an optically interconnected multiprocessor Si chip. Marco Romagnoli is actually WP leader for Graphene wafer scale integration within the EU Graphene Flagship, he is director of the Si Photonics Design Center at CNIT and he is author of more than 200 journal papers and conference contributions, he is also inventor in more than 50 patents.